The output value of the Taiwan Q2 testing industry in 2010Q2 was NT$ 3,25 billion, which represented a growth of 14.0% from 2010Q1 and a growth of 54.8% from the same period of last year. The main reason is the strong demand for mobile phone chips and graphics chips and the continued buoyant memory shipments to drive the growth of overall output value. In addition, due to the impact of the international gold price surge, the conversion of gold wire to copper wire encapsulation is still a topic of continuous concern for the latter.
2010Q2 in Taiwan IC packaging and testing industry trends in the main manufacturers, for the force of the UMC, Elpida cooperation trial production of next year 28nm process 3DIC chip. The three major manufacturers held a signing ceremony for TSV technology on June 21st. This is a rare cross-industry cooperation in the field of logic and memory technology in recent years. The three major plants will upgrade 3DIC's integrated technology for advanced process of 28nm, using Elpida's DRAM. Technology and UMC's advanced logic technology, together with the packaging technology developed by the company, have jointly developed a 3DIC heterogeneity integrated solution for LogicIC and DRAM.
Under the trend of component specifications such as high-efficiency, high integration, and low power consumption of electronic products, semiconductor manufacturers no longer follow the development of Moore's Law. 3DIC has become the future path for advanced packaging. In the future, LogicIC will integrate Mobile DRAM with mobile phones. Will be the largest application market.
LogicIC, such as graphics chips, can also be integrated with DRAM to achieve high-speed, high-performance requirements, and future applications will be very broad. Li Cheng, UMC, and Elpida saw the largest block of 3DIC market and have already actively collaborated and hope to take the lead in grabbing the LogicIC and Memory stack markets.
Analysis of major events: Chuangchuang and Maode cooperation entered SDRAM, Taiwan DRAM factory layout non-standard products
ProMOS and niche-type memory plant Kontron will form an alliance to build a high-capacity 256Mb DDR2 product for the company's 12-inch wafer fab, using 72nm process technology. This is ProMOS' first step into the consumer electronics market. It also obtained capacity supply in the event of tight SDRAM capacity. ProMOS also uses Elpida 63nm process layout MobileRAM market, from 128Mb products cut into, is expected to mass production in the second quarter of 2011, specializing in the low-end mobile phone market.
In addition to ProMOS's awareness of the risk of diversification, South Asia Branch also plans to deploy the MobileRAM market from the Low-PowerDDR/DDR2 market, hoping to significantly reduce the proportion of PC-related products, and is expected to enter trial production in the third quarter of 2010.
After the financial turmoil, Taiwan’s DRAM makers started to diversify their product line strategy. They only focus on the risks of standard DRAM products. Since 2010, DRAM plants have been reported to have begun to lay out non-standard DRAM products, including SDRAM, Mobile RAM, NAND Flash, and graphics. Card memory (GDDR) and so on.
For example, the Japanese DRAM maker Elpida started its transformation in 2010, releasing most of the standard DRAM production to Taiwan, and Elpida's production capacity at the Hiroshima plant was fully loaded with MobileRAM products. Elpida has invested in consumer products. Electronic related products. Micron has also focused its standard DRAMs on the sub-subjects of Inacore, and it has focused on the layout of NAND Flash and NORFlash. The diversification of its product lines will become increasingly apparent.
Major Event Analysis: Global Expansion's Large-Scale Expansion Will Form Strong Competitive Pressure on UMC
GlobalFoundries held a press conference in Taiwan on June 1st to announce a global capacity expansion plan. GlobalFoundries said that the global wafer industry has shown a recovery trend in 2010. After the company acquired Singapore Chartered Semiconductor in 2009, the 12-inch wafer production capacity has surpassed that of the second largest global foundry UMC. The current priority is to integrate its German company. , Singapore and the United States fab, there is no plan to invest in other fabs.
GlobalFoundries said that the company’s capital expenditures are expected to reach $2.7 billion to $2.8 billion in 2010, and about $1.5 billion in 2011. It is expected that an annual output of 1.6 million 12-inch wafers is expected in 2014. Both Globalfoundries and Singapore's Chartered are members of the Common Platform. The merger of the two companies will facilitate the integration of manufacturing capacity within the alliance and seek outsourcing orders for IDM manufacturers.
The consolidated Globalfoundries, through the strong support of ATIC funds from major shareholders, has expanded its 12-inch wafer fab capacity. Under the advantages of ATIC funds and IBM Common Platform technology, it has formed strong competition for UMC in Taiwan. In the future, the second and third largest market share of global professional foundry market will become increasingly fierce.
Analysis of major events: South Korea's Hynix and mainland Taiji Industrial have established a joint venture to establish a memory and packaging plant Haitai Semiconductor
Haitai Semiconductor is a joint venture between Wuxi Taiji Industry and Korea Hynix, with a total investment of US$350 million. It focuses on probe testing and packaging of semiconductor products. It plans to use 1G DRAM as the main product, with a capacity of 75 million cells per month for packaging and testing, and annual sales of 300 million U.S. dollars. It is the mainland's most technologically advanced integrated circuit packaging and testing company. Wuxi integrated circuit industry has formed a complete industrial chain including chip design, wafer manufacturing, packaging and testing, silicon single crystal materials and epitaxial wafers, masks, etc.
Following the joint venture between Japan’s IDM Toshiba and mainland Nantong Fujitsu to establish the “Wuxi Tongzhi Co., Ltd.â€, which is a joint-stocking and testing plant, Taiji Industrial Co., Ltd. is currently establishing a joint venture with Hynix to establish Haitai Semiconductor, a memory and packaging plant. Through a joint venture with major international companies, the mainland has actively introduced advanced technologies and demonstrated its intention to develop advanced high-level packaging and testing technologies.
Hynix and ST already have a 12-inch memory fab in Wuxi on the mainland, with a monthly production capacity of 40,000 wafers and process technology of 90-45nm. The establishment of Haitai Semiconductor will enable Hynix to establish a one-stop production method in China to save production and logistics costs and further increase cost advantages. If the mainland obtains advanced technology through cooperation with international companies, which in turn will promote the technological upgrading and transformation of the local packaging and testing industry, it will pose a threat to the global competitiveness of the Taiwanese packaging industry in the future.
In the second half of 2009 , the global semiconductor industry was affected by the national government's economic revitalization program, which led to a significant growth in global semiconductor sales compared to the first half of 2009. In the first half of 2010, the pace of global economic recovery was better than expected, coupled with insufficient capacity, which also made sales performance in the first half of this year show a bright performance. Therefore, it is estimated that the annual growth rate and quarterly growth rate in the third quarter will be affected by the high base period and weaken the growth.
Although industry growth will be slowed down, the shortage of foundry and packaging production capacity will continue, which can be confirmed by semiconductor manufacturers’ announcement of a substantial increase in capital expenditure.
Looking into the third quarter, in the IC design industry, the output value of the Taiwan IC design industry in 2010Q3 is expected to reach NT$137.5 billion, which represents an increase of 15.0% over 2010Q2. As Taiwan's IC design industry has gradually entered the cycle of steady growth, the third and fourth quarter will remain the traditional peak season. It is expected that in the future driven by demand from PC, NB, LCDTV, and mobile phones, the 2010 output value will reach NT$503.2 billion. Growth will reach 30.4%, far exceeding 2.9% in 2009.
In the IC manufacturing sector, the output value of Taiwan's IC manufacturing industry in 2010Q3 was estimated to reach NT$229 billion, a 5.2% increase from 2010Q2. Due to the high base period in the first half of 2010 and the gradual increase in output value before the financial turmoil from the third quarter of last year, the quarterly cost and annual growth of Taiwan's IC manufacturing industry in the second half of 2010 will show a trend.
GlobalFoundries said that the company’s capital expenditures are expected to reach $2.7 billion to $2.8 billion in 2010, and about $1.5 billion in 2011. It is expected that an annual output of 1.6 million 12-inch wafers is expected in 2014. Both Globalfoundries and Singapore's Chartered are members of the Common Platform. The merger of the two companies will facilitate the integration of manufacturing capacity within the alliance and seek outsourcing orders for IDM manufacturers.
The consolidated Globalfoundries, through the strong support of ATIC funds from major shareholders, has expanded its 12-inch wafer fab capacity. Under the advantages of ATIC funds and IBM Common Platform technology, it has formed strong competition for UMC in Taiwan. In the future, the second and third largest market share of global professional foundry market will become increasingly fierce.
Analysis of major events: South Korea's Hynix and mainland Taiji Industrial have established a joint venture to establish a memory and packaging plant Haitai Semiconductor
Haitai Semiconductor is a joint venture between Wuxi Taiji Industry and Korea Hynix, with a total investment of US$350 million. It focuses on probe testing and packaging of semiconductor products. It plans to use 1G DRAM as the main product, with a capacity of 75 million cells per month for packaging and testing, and annual sales of 300 million U.S. dollars. It is the mainland's most technologically advanced integrated circuit packaging and testing company. Wuxi integrated circuit industry has formed a complete industrial chain including chip design, wafer manufacturing, packaging and testing, silicon single crystal materials and epitaxial wafers, masks, etc.
Following the joint venture between Japan’s IDM Toshiba and mainland Nantong Fujitsu to establish the “Wuxi Tongzhi Co., Ltd.â€, which is a joint-stocking and testing plant, Taiji Industrial Co., Ltd. is currently establishing a joint venture with Hynix to establish Haitai Semiconductor, a memory and packaging plant. Through a joint venture with major international companies, the mainland has actively introduced advanced technologies and demonstrated its intention to develop advanced high-level packaging and testing technologies.
Hynix and ST already have a 12-inch memory fab in Wuxi on the mainland, with a monthly production capacity of 40,000 wafers and process technology of 90-45nm. The establishment of Haitai Semiconductor will enable Hynix to establish a one-stop production method in China to save production and logistics costs and further increase cost advantages. If the mainland obtains advanced technology through cooperation with international companies, which in turn will promote the technological upgrading and transformation of the local packaging and testing industry, it will pose a threat to the global competitiveness of the Taiwanese packaging industry in the future.
In the second half of 2009 , the global semiconductor industry was affected by the national government's economic revitalization program, which led to a significant growth in global semiconductor sales compared to the first half of 2009. In the first half of 2010, the pace of global economic recovery was better than expected, coupled with insufficient capacity, which also made sales performance in the first half of this year show a bright performance. Therefore, it is estimated that the annual growth rate and quarterly growth rate in the third quarter will be affected by the high base period and weaken the growth.
Although industry growth will be slowed down, the shortage of foundry and packaging production capacity will continue, which can be confirmed by semiconductor manufacturers’ announcement of a substantial increase in capital expenditure.
Looking into the third quarter, in the IC design industry, the output value of the Taiwan IC design industry in 2010Q3 is expected to reach NT$137.5 billion, which represents an increase of 15.0% over 2010Q2. As Taiwan's IC design industry has gradually entered the cycle of steady growth, the third and fourth quarter will remain the traditional peak season. It is expected that in the future driven by demand from PC, NB, LCDTV, and mobile phones, the 2010 output value will reach NT$503.2 billion. Growth will reach 30.4%, far exceeding 2.9% in 2009.
In the IC manufacturing sector, the output value of Taiwan's IC manufacturing industry in 2010Q3 was estimated to reach NT$229 billion, a 5.2% increase from 2010Q2. Due to the high base period in the first half of 2010 and the gradual increase in output value before the financial turmoil from the third quarter of last year, the quarterly cost and annual growth of Taiwan's IC manufacturing industry in the second half of 2010 will show a trend.
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