Sensor Industry Three Strategic Goals in 2012

China's sensor technology and products have been greatly improved through development. There are more than 1,600 enterprises and institutions in the country engaged in sensor research, development and production. However, compared with foreign countries, China's sensor product varieties and quality levels, can not meet the needs of the domestic market, the overall level is still in the foreign countries in the early 1990s.

Domestic sensors also have poor scientific and technological innovation. The core manufacturing technology lags behind that of foreign countries. There are few products with independent intellectual property rights, and the varieties are incomplete. The product technology level differs from that of foreign countries by about 15 years; the investment intensity is low, and scientific research equipment and production technology equipment are behind. Low level of achievement, poor product quality, dislocation of technology and production, impact on the transformation of scientific research results, low comprehensive strength, and lack of potential for industrial development.

By 2012, the sensor field should strive to achieve three strategic goals:

With industrial control, automotive, communications and environmental protection as the key service areas, with sensors, flexible components, optical components, and special circuits as the key targets, we will develop original technologies and products with independent intellectual property rights. Based on the MEMS process, relying on integrated, intelligent and networked technologies, the company will strengthen the manufacturing process and the development of new sensors and instrumentation components so that the leading products can reach and reach the advanced level of similar foreign products. To increase the variety, improve quality and economic efficiency as the main goal, accelerate industrialization, so that the domestic sensor occupancy rate of the species reached 70% to 80%, up to 60% of high-end products.

Sensor development priorities in 2012 (1) MEMS technology and a new generation of solid-state sensor microstructure manufacturing process; deep reactive ion etching (DRIE) process or IGP process, packaging process; such as normal temperature bonding flip-chip welding, stress-free thin and thin structure packaging, Multi-chip assembly process; new sensors; such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro-sensors; automotive pressure, acceleration sensors, environmental protection micro-chemical sensors.

(2) Integrated process and multivariable composite sensors Microstructure integrated manufacturing process, multivariable composite sensors for industrial control, such as: pressure, static pressure, temperature three-variable sensors, air pressure, wind force, temperature, humidity four-variable sensors, micro silicon composite Strain pressure sensor, display sensor.

(3) Intelligent technologies and smart sensor signals Wired or wireless detection, transformation processing, logic judgment, function calculation, two-way communication, self-diagnosis and other intelligent technologies, intelligent multivariable sensors, smart power sensors and various smart sensors, transmission Device.

(4) Networked technology and networked sensor sensor networking technology; Networked sensors enable the sensor to have industrial standard interface and protocol functions.

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