STMicroelectronics (ST) Global Navigation Satellite System (GNSS) chips will enter consumer electronics (CE) applications next year. After exiting ST-Ericsson ’s operations in the third quarter of this year, ST ’s GNSS chip business will no longer be affected by automotive applications; therefore, the company has expected mass production early next year to be applied to smartphones, tablets and smart phones The third-generation GNSS chip of the watch, Teseo III, is tapping into the consumer electronics market.
ST's Deng Yindun, product marketing manager for the microprocessor and radio frequency products business group of STMicroelectronics' automotive products business, said that the third-generation GNSS chips mass-produced by STMicroelectronics early next year will fully expand the scope of application.
ST-Ericsson was responsible for the consumer electronics application business of the internal agreement GNSS chip in the company to avoid product line conflicts. After semiconductor announced that it will cut with ST-Ericsson, this concern will no longer exist, so ST's next-generation GNSS chip will fully grab into various application fields.
Deng Yindun further pointed out that since most consumer electronic products are portable applications, the requirements for small size and low power consumption design are relatively high; in view of this, STMicroelectronics will take advantage of its own wafer manufacturing plant, for new The GNSS chip manufacturing process and technology are upgraded. Therefore, the future generation of GNSS chips is expected to be more than 40% smaller than the second-generation products and reduce power consumption by two-thirds, so as to strengthen the competitiveness of the global consumer electronics application market.
However, Deng Yindun emphasized that although the third-generation products will expand the scope of application, because ST's GNSS chip currently ranks second in the global auto market, the company's main market is still in car navigation applications.
It is worth mentioning that, because STMicroelectronics has MEMS product lines such as Gyroscope and G-Sensor, the third-generation Teseo solution can cooperate with MEMS sensors. In order to strengthen the dead-reckoning (Dead-Reckoning) function, the navigation system can also calculate the relative address by itself in the tunnel and other places where the satellite signal cannot be received, so as to improve the positioning accuracy.
Not only that, STMicroelectronics' GNSS chip has a microcontroller (MCU) function, which can replace the general 32-bit MCU, which can help GNSS module manufacturers reduce product size and reduce costs.
On the other hand, STMicroelectronics will launch the third-generation GNSS chip next year. Since the Beidou navigation satellite system in mainland China has been officially launched at the end of 2012, STMicroelectronics will also launch on the basis of Teseo II in the second half of 2013. The Beidou system's GNSS chips are sold with a strategy of increasing the amount and not increasing the price.
Deng Yindun explained that since STMicroelectronics ’GNSS chip provides a complete software development kit (SDK), it can open up module factories or system integrators to structure its applications on the chip core. Manufacturers who want to upgrade to support the Beidou system can do so simply by updating the software, and can do their utmost to assist customers in attacking Beidou business opportunities.
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