Earlier, it was reported that Apple had invested nearly $500 million to purchase a large number of sapphire-making boilers for the new plant in Arizona. At the same time, cooperation with GT Advanced began.
The previous news also revealed that Apple and GT have signed a cooperation agreement for many years. Today, Canonical CEO Mark Shuttleworth reveals that Apple has purchased enough sapphire screens for three years. Shuttleworth said in an interview: "Apple recently purchased a sapphire screen that is fully available for 3 years, which is the screen we plan to use on the Edge of the first Ubuntu system phone."
At the beginning of the month, Apple reported that the material purchased by the Mesa factory was enough to produce hundreds of millions of 5-inch sapphire screens. This year Apple will introduce two screen-sized iPhones, 4.7 inches and 5.5 inches, each with sapphire glass.
Usually,10 & 20 layers PCB are HDI board,but some are not .Some with big trace width and space,holes are over 0.3mm too. We have much experience in doing 10 Layer PCB & 20 layer PCB.
A ten-layer board should be used when six routing layers are required. Ten-layer boards, therefore, usually have six signal layers and four planes. Having more than six signal layers on a ten-layer board is not recommended. Ten-layers is also the largest number of layers that can usually be conveniently fabricated in a 0.062" thick board. Occasionally you will see a twelve-layer board fabricated as a 0.062" thick board, but the number of fabricators capable of producing it are limited..
High layer count boards (ten +) require thin dielectrics (typically 0.006" or less on a 0.062" thick board) and therefore they automatically have tight coupling between layers. When properly stacked and routed they can meet all of our objectives and will have excellent EMC performance and signal integrity.
A very common and nearly ideal stack-up for a ten-layer board is shown in Figure 12. The reason that this stack-up has such good performance is the tight coupling of the signal and return planes, the shielding of the high-speed signal layers, the existence of multiple ground planes, as well as a tightly coupled power/ground plane pair in the center of the board. High-speed signals normally would be routed on the signal layers buried between planes (layers 3-4 and 7-8 in this case).
10 Layer PCB
10 layer PCB 10 layer TG170 PCB 10 layer design
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