TDK Corporation (President: Jianhong Tan) introduced a groundbreaking series of high-frequency inductors called MHQ0603P, which represents the highest level of Q characteristics in the industry using a laminated construction method. These components went into mass production in July 2013.
The MHQ0603P series (dimensions: L: 0.65 × W: 0.35 × H: 0.35 mm) achieves a Q value of 35 at 35 GHz with an inductance of 3.9 nH—25% higher than its predecessor, the MLG0603W. This performance is comparable to that of traditional wound inductors of similar size. Compared to the earlier MHQ1005P series (L: 1.0 × W: 0.6 × H: 0.5 mm), the new model is 26% smaller in volume and 38% smaller in package area, making it ideal for space-constrained applications.
The improved Q characteristics are achieved through the use of advanced dielectric and internal electrode materials, which help reduce surface roughness and minimize high-frequency losses. TDK’s proprietary structural design enables this high-performance inductor to maintain excellent Q values despite its compact size.
As mobile devices become more multifunctional, the demand for high-efficiency, high-frequency circuits continues to grow. The MHQ0603P series helps meet these demands by offering superior performance while saving valuable board space.
In addition to the existing MHQ1005P lineup, TDK now offers the MHQ0603P series, expanding its product portfolio to better serve the needs of modern wireless communication systems.
Q Factor: The Q factor, or quality factor, measures the ratio of inductive reactance to resistance at a given frequency. A higher Q value indicates a more ideal inductor, with lower energy loss and better performance at high frequencies.
Main Applications:
- Smartphones and tablets
- Bluetooth and Wi-Fi modules
- High-frequency circuits and modules such as Power Amplifiers (PA), Voltage-Controlled Oscillators (VCO), and Front-End Modules (FEM)
Key Features:
- Reduces high-frequency circuit loss by 26% compared to conventional MHQ1005P
- Smaller footprint, saving 38% of the package area
- Miniaturized design suitable for next-generation mobile devices
Main Parameters:
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